3D Chiplet Engineer

<p style="min-height: 1.7em;"></p><p><strong><span style="color:#222222">About Us</span></strong><span style="color:#222222"> : </span><span style="color:#000000">AI compute is hitting a hard physical wall, and memory bottlenecks are throttling the entire industry. Founded in October 2024 and backed by €57M in funding, Vertical Compute is solving this with proprietary Vertical Integrated Memory (VIM™) chiplets, making AI hardware faster, greener, and vastly more scalable. We are an interdisciplinary team transforming breakthrough semiconductor physics into commercial reality.</span></p><p><strong><span style="color:#222222">Why Now</span></strong><span style="color:#222222"> : </span><span style="color:#000000">After 18 months of intensive R&amp;D, Vertical Compute has reached a critical inflection point. Our underlying technology is validated, and we have successfully met our core technical milestones. Armed with a proven technical data package and ongoing system studies, we are now shifting from pure R&amp;D to active engagement with global enterprise customers. As we prepare for our next phase of scale and growth starting in 2027, joining us today means taking direct ownership of the hardware foundation that will power the next era of AI compute.</span></p><p style="min-height: 1.7em;"></p><p style="min-height: 1.7em;"></p><p style="text-align:justify;"><strong><span style="color:#222222">About the role:&nbsp;</span></strong></p><p style="text-align:justify;"><span style="color:#000000">We are looking for a 3D Integration / Chiplet Expert to define and implement 2.5D/3D advanced packaging solutions for our Vertical Integrated Memory (VIM) technology. You will collaborate across teams to define optimal interconnect strategies and die stacking approaches to enable high-bandwidth, low-power operation. This job sits at the intersection of SoC architecture (specifically the physical design) , package design, and 3D manufacturing processes.&nbsp;</span></p><p style="text-align:justify;"><strong><span style="color:#222222">Key Responsibilities:</span></strong></p><ul><li><p style="text-align:justify;"><strong><span style="color:#222222">Integration Architecture &amp; Process Definition</span></strong><span style="color:#222222">: <br>Develop and define architectures for 2.5D/3D stacking of VIM chiplets with compute chiplets. <br>Collaborate with design and technology teams to develop interconnect solutions that ensure high bandwidth and low latency.<br>Define clearly the impact of the chiplet physical design chiplets (through-silicon vias, micro-bumps, hybrid bonds, redistribution layers, and chiplet interfaces, …)<br>define fabrication flows and design rules with foundries, packaging partners, and internal physical design teams</span></p></li><li><p style="text-align:justify;"><strong><span style="color:#222222">Performance Analysis &amp; Simulation: <br></span></strong><span style="color:#222222">Conduct early multi-physics simulations (thermal, electrical, mechanical) to analyze and optimize the performance and reliability of integrated systems.<br>drive external partners for final package design</span></p></li></ul><ul><li><p style="text-align:justify;"><strong><span style="color:#222222">Collaboration &amp; Communication:<br></span></strong><span style="color:#222222">Partner closely with design, process engineering, metrology, and system architecture teams. <br>Participate in conferences, standardization bodies and industry events to promote or lead discussions about the future of chiplet integration.</span></p></li><li><p style="text-align:justify;"><strong><span style="color:#222222">Technical Leadership:Provide</span></strong><span style="color:#222222"> <br>technical leadership and project management guidance to multidisciplinary&nbsp; teams.</span></p></li></ul><p style="text-align:justify;"><strong><span style="color:#222222">About the team:&nbsp;</span></strong></p><p style="text-align:justify;"><span style="color:#222222">This role is part of the Product &amp; system team, partnering closely with our cross-functional engineering teams in Product &amp; system&nbsp; and Memory Design. We foster a highly collaborative, inclusive environment where strong alignment, high transparency and seamless team coordination are central to our shared success.</span></p><p><span style="color:#000000"><br></span></p> <br> <p style="min-height: 1.7em;"></p><p><strong><span style="color:#222222">About who you are:</span></strong></p><ul><li><p><span style="color:#000000">You’ve spent 5–10 years exploring the frontiers of 2.5D/3D packaging and heterogeneous integration, turning complex ideas into manufacturable systems.</span></p></li><li><p><span style="color:#000000">You have a deep understanding on the SoC physical design, TSVs, Redistribution Layers, hybrid bonding and how they are used at system level to implement chip IOs (Functional and power IOs)&nbsp;&nbsp;&nbsp;</span></p></li><li><p><span style="color:#000000">You are mastering Integrity 3D-IC Platform to define the chiplets interface, to define 3D stacking system, to generate the 3Dblox views, and to run all the 3D system level analysis (Power Delivery Network, Thermal, STA, LVS, SI/PI, …)&nbsp;&nbsp;&nbsp;&nbsp;</span></p></li><li><p><span style="color:#000000">You thrive where architecture meets technology — translating ambitious concepts into elegant, high-performance designs.</span></p></li><li><p><span style="color:#000000">Multi-physics isn’t just theory to you; you use thermal, electrical, and mechanical simulations to see the whole system clearly.</span></p></li><li><p><span style="color:#000000">You’re naturally collaborative — just as comfortable in technical deep dives as you are building bridges between design, process, and system teams.</span></p></li><li><p><span style="color:#000000">You’re the kind of engineer who balances vision with execution: leading projects, mentoring peers, and pushing boundaries with a calm hand.</span></p></li><li><p><span style="color:#000000">Above all, you’re curious — drawn to the challenge of building something new and meaningful at the intersection of memory, compute, and packaging innovation.</span></p></li><li><p><span style="color:#000000">Fluency in English with strong written and verbal communication abilities.</span></p></li></ul><p><br></p><p><strong><span style="color:#222222">Why Join Us:</span></strong></p><ul><li><p style="text-align:justify;"><span style="color:#000000">You will get the opportunity to work at the forefront of memory technology innovation.</span></p></li><li><p style="text-align:justify;"><span style="color:#000000">Vertical Compute is not only a state-of-the art but also a human adventure. We believe you must have a lot of fun developing the best of you. Making sure you and your team are going to enjoy the journey and become passionate about what we do is a key goal of our founders.</span></p></li><li><p style="text-align:justify;"><span style="color:#000000">You can be part of a talented and dedicated team in a fast-paced startup environment.</span></p></li><li><p style="text-align:justify;"><span style="color:#000000">In this role, you contribute to projects that will have a significant impact on the future of computing and electronics.</span></p></li><li><p style="text-align:justify;"><span style="color:#000000">You can count on a motivating total rewards package.</span></p></li><li><p style="text-align:justify;"><span style="color:#000000">Flexible ways of working.</span></p></li></ul><p style="min-height: 1.7em;"></p><p><strong><span style="color:#000000">Join us in shaping the future of compute &amp; memory technology — and celebrating success!</span></strong></p><p style="min-height: 1.7em;"></p><p>Find <a href="https://www.arbeitnow.fr">Jobs in France</a> on Arbeitnow</a>