Principal Thermal-Mechanical Engineer - (Munich, Germany)

<p style="min-height:1.5em"><strong>About Us</strong></p><p style="min-height:1.5em">We are building <strong>Physics AI for hardware design</strong>. Our software platform helps hardware designers and physics simulation engineers explore, analyze, and optimize hardware systems, leveraging cutting-edge AI to deliver ultrafast, accurate physics intelligence within the realities of engineering design workflows.</p><p style="min-height:1.5em">By bridging the gap between traditional simulation and machine learning, we are redefining how the world’s most advanced semiconductors are designed, verified, built, brought to market and integrated in complex systems.</p><p style="min-height:1.5em"></p><p style="min-height:1.5em"><strong>Role Overview</strong></p><p style="min-height:1.5em">As part of the <strong>Forward Deployment team in Europe,</strong> you will play a pivotal role in driving the adoption of Vinci’s platform among leading engineering organizations. This is a <strong>high-impact leadership position</strong> where you will build, mentor, and lead a team of thermal and thermo-mechanical engineers focused on engaging prospective customers and demonstrating the transformative value of Vinci’s software.</p><p style="min-height:1.5em">You and your team will bring <strong>deep expertise in thermal and thermo-mechanical simulation</strong>, applying hands-on experience to validate real-world customer designs using Vinci’s platform. Through these engagements, you will <strong>showcase how Vinci enables significant improvements</strong> in product design, thermal and mechanical performance, reliability, and time-to-market.</p><p style="min-height:1.5em">Leveraging strong fundamentals in <strong>thermal physics and continuum mechanics</strong>, you will guide analyses of complex physical phenomena, including steady-state and transient thermal behavior, linear and nonlinear mechanics, geometric and material nonlinearities, and contact interactions. Your team will <strong>evaluate critical factors</strong> such as thermal risk, warpage, stress evolution, and reliability across advanced semiconductor devices, electronics packages, and wafer-scale systems.</p><p style="min-height:1.5em">You will work closely with <strong>customer engineering teams</strong> to understand their technical challenges, provide expert guidance, and clearly articulate Vinci’s capabilities in solving real-world problems. Additionally, you will serve as a <strong>key feedback channel t</strong>o product and engineering teams, translating customer insights into actionable inputs that shape product direction and drive continuous improvement.</p><p style="min-height:1.5em">This is a <strong>remote role, </strong>with close collaboration with Sales, Product, and Engineering in Palo Alto, CA, USA. The role includes <strong>moderate travel</strong>, primarily within continental Europe. Some <strong>infrequent intercontinental travel </strong>may be required for discussions and collaboration with the US team<strong>.</strong> This role may require being onsite several days per week in Munich, to collaborate on joint programs with a world-leading research institute.</p><p style="min-height:1.5em"></p><p style="min-height:1.5em"><strong>Responsibilities</strong></p><ul style="min-height:1.5em"><li><p style="min-height:1.5em"><strong>Build, lead, and scale</strong> a high-performing team of thermal and thermo-mechanical engineers, setting technical direction, mentoring team members, and driving execution.</p></li><li><p style="min-height:1.5em">Engage with customer engineering teams during the <strong>evaluation phase</strong> by supporting simulation setup, running test cases, and interpreting results to demonstrate Vinci’s value.</p></li><li><p style="min-height:1.5em">Collaborate with the <strong>sales team</strong> to deliver product demonstrations, conduct proof-of-concept evaluations, and participate in in-depth technical discussions with prospective customers.</p></li><li><p style="min-height:1.5em">Support <strong>customer onboarding and deployments </strong>by providing technical guidance, training, and troubleshooting throughout the deployment and production phases.</p></li><li><p style="min-height:1.5em">Identify customer pain points and workflow challenges, and collaborate with the <strong>product and engineering teams</strong> to improve product capabilities and overall customer experience.</p></li><li><p style="min-height:1.5em">Deliver <strong>technical training sessions and workshops </strong>to enable customer teams to effectively adopt and scale Vinci within their engineering workflows.</p></li><li><p style="min-height:1.5em">Represent Vinci at <strong>industry conferences and semiconductor events </strong>by delivering live product demonstrations, managing booth activities, and engaging technically with prospective customers and partners.</p></li><li><p style="min-height:1.5em">Maintain a strong understanding of <strong>competitive technologies, industry trends, and market positioning</strong> to effectively communicate Vinci’s differentiators.</p></li></ul><p style="min-height:1.5em"></p><p style="min-height:1.5em"><strong>Qualifications</strong></p><p style="min-height:1.5em"><strong>Required</strong></p><ul style="min-height:1.5em"><li><p style="min-height:1.5em">Degree in Mechanical, Electrical, or related engineering field</p></li><li><p style="min-height:1.5em">15+ years of hands-on thermal management, mechanical warpage, stress and reliability using commercial software such as Flowthem, Cadence, Ansys, Abaqus, LS Dyna, etc.</p></li><li><p style="min-height:1.5em">Scripting experience using python or C++</p></li><li><p style="min-height:1.5em">Strong communication and interpersonal skills.</p></li><li><p style="min-height:1.5em">Prior managerial or leadership Experience</p></li><li><p style="min-height:1.5em">Prior experience in Customer-facing roles</p></li><li><p style="min-height:1.5em">Strong problem-solving mindset and ability to quickly learn new tools and workflows</p></li><li><p style="min-height:1.5em">Strong ability to communicate complex results clearly to a mixed audience (technical + business)</p></li></ul><p style="min-height:1.5em"><strong>Preferred</strong></p><ul style="min-height:1.5em"><li><p style="min-height:1.5em">Familiarity with semiconductor electronics packaging, advanced packaging or foundry (chip warpage, wafer warpage, 2.5D/3D IC, etc.)</p></li><li><p style="min-height:1.5em">Experience in pre-sales, technical sales, or customer-facing engineering roles</p></li><li><p style="min-height:1.5em">Ability to rapidly learn and adapt to new physics-based workflows and AI-assisted design tools</p></li><li><p style="min-height:1.5em">Experience with commercializing technical software—ideally EDA or simulation tools—into semiconductor and electronics companies</p></li></ul><p style="min-height:1.5em"></p><p style="min-height:1.5em"><strong>Why Join Us</strong></p><ul style="min-height:1.5em"><li><p style="min-height:1.5em">Be part of a team defining the future of AI in hardware design.</p></li><li><p style="min-height:1.5em">Work at the intersection of advanced AI, real-world engineering, and customer success.</p></li><li><p style="min-height:1.5em">Collaborate with world-class engineers and researchers in a fast-moving startup environment.</p></li></ul><hr><p>Compensation: SGD 1 – SGD 2</p><ul><li> • SGD 1 – SGD 2</li></ul><p>Find <a href="https://www.arbeitnow.com">Jobs in Germany</a> on Arbeitnow</a>